SST12LF02 datasheet(6/17 Pages) MICROCHIP

6 / 17 page

DS-70005001D

01/15

2.4 GHz WLAN High-Gain, High-Efficiency FEM

SST12LF02

Data Sheet

Electrical Specifications

The DC and RF specifications for the power amplifier are specified below. Refer to Table 3 for the DC voltage

and current specifications. Refer to Figures 3 through 11 for the RF performance.

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute

Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and

functional operation of the device at these conditions or conditions greater than those defined in the

operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating con-

ditions may affect device reliability.)

Input power to pin 3 (PIN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm

Average output power from pin 11 (POUT)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +26 dBm

1. Never measure with CW source. Pulsed single-tone source with <50% duty cycle is recommended. Exceeding the max-

imum rating of average output power could cause permanent damage to the device.

Supply Voltage at pins 6 and 9 (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +4.0V

Reference voltage to pin 4 (VREF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.3V

DC supply current (ICC)2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA

2. Measured with 100% duty cycle 54 Mbps 802.11g OFDM Signal

Operating Temperature (TA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC

Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC

Maximum Junction Temperature (TJ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150ºC

Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds

Table 2: Operating Range

Range

Ambient Temp

VCC

Extended

-20°C to +85°C

3.3V

Table 3: DC Electrical Characteristics at 25°C for TX Chain, 11g operation

Symbol

Parameter

Min.

Typ

Max.

Unit

VCC

Supply Voltage at pins 6 and 9

3.0

3.3

3.6

ICQ

Idle current. No RF input, PA biased for 18 dBm at 3% EVM

VREG

Reference Voltage

2.75

2.80

2.95

ICC

Supply Current

for 11g OFDM 54 Mbps signal, POUT = 21 dBm

160

for 11b DSSS 1 Mbps signal, POUT = 21 dBm

165

T3.1 75001

Table 4: DC Electrical Characteristics at 25°C for TX Chain, 11n and 256 QAM operation

Symbol

Parameter

Min.

Typ

Max.

Unit

ICQ

Idle current. No RF input, PA biased for 18 dBm at 3% EVM

VREG

Reference Voltage

2.90

2.95

3.00

ICC

Supply Current

for 11n, MCS7, POUT = 17 dBm

120

for 256 QAM, MCS9 POUT = 16 dBm

110

T4.1 75001

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