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TPCP8BA1 Datasheet(PDF) 1 Page - Toshiba Semiconductor |
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TPCP8BA1 Datasheet(HTML) 1 Page - Toshiba Semiconductor |
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1 / 4 page ![]() TPCP8BA1 Silicon P Channel MOS Type (U-MOS-II) / Silicon Epitaxial Schottky Barrier Diode TPCP8BA1 ○ DC-DC Converter Combined Pch MOSFET and Schottky Diode into one Package. • • Low RDS (ON) and Low VF Maximum Ratings (Ta = 25°C) MOSFET Characteristics Symbol Rating Unit Drain-Source voltage VDS −20 V Gate-Source voltage VGSS ±12 V DC ID −1.3 Drain current Pulse IDP (Note 2) −2.6 A Drain power dissipation PD (Note 1) 1.0 W Channel temperature Tch 150 °C Maximum Ratings (Ta = 25°C) SCHOTTKY DIODE Characteristics Symbol Rating Unit Maximum (peak) reverse voltage VRM 30 V Reverse voltage VR 25 V Average forward current IO 0.7 A Peak one cycle surge forward current (non-repetitive) IFSM 4 (50 Hz) A Junction temperature Tj 125 °C 単位: mm JEDEC JEITA TOSHIBA TOSHIBA Weight: mg (typ) 1:Anode 2:N/C 3:Source 4:Gate 5,6:Drain 7,8:Cathode TENTATIVE Maximum Ratings (Ta = 25°C) MOSFET, DIODE COMMON Characteristics Symbol Rating Unit Storage temperature Tstg −55~125 °C Operating temperature Topr (Note 3) −40~85 °C Note 1: Mounted on FR4 board (25.4 mm × 25.4 mm × 1.6 t, Cu pad: 645 mm2) Note 2: The pulse width limited by max channel temperature. Note 3: Operating temperature limited by max channel temperature and max junction temperature. Handling Precaution When handling individual devices (which are not yet mounting on a circuit board), be sure that the environment is protected against electrostatic discharge. Operators should wear anti-static clothing and use containers and other objects that are made of anti-static materials. The Channel-to-Ambient thermal resistance Rth (ch-a) and the drain power dissipation PD vary according to the board material, board area, board thickness and pad area. When using this device, please take heat dissipation fully into account. 2003-12-19 1 |
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Similar Description - TPCP8BA1 |
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