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TPCP8BA1 Datasheet(PDF) 1 Page - Toshiba Semiconductor

Part # TPCP8BA1
Description  Silicon P Channel MOS Type (U-MOS-II) / Silicon Epitaxial Schottky Barrier Diode
PDF  4 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TPCP8BA1 Datasheet(HTML) 1 Page - Toshiba Semiconductor

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TPCP8BA1
Silicon P Channel MOS Type (U-MOS-II) / Silicon Epitaxial Schottky Barrier Diode
TPCP8BA1
○ DC-DC Converter
Combined Pch MOSFET and Schottky Diode into one Package.
•
• Low RDS (ON) and Low VF
Maximum Ratings (Ta = 25°C) MOSFET
Characteristics
Symbol
Rating
Unit
Drain-Source voltage
VDS
−20
V
Gate-Source voltage
VGSS
±12
V
DC
ID
−1.3
Drain current
Pulse
IDP (Note 2)
−2.6
A
Drain power dissipation
PD (Note 1)
1.0
W
Channel temperature
Tch
150
°C
Maximum Ratings (Ta = 25°C) SCHOTTKY DIODE
Characteristics
Symbol
Rating
Unit
Maximum (peak) reverse voltage
VRM
30
V
Reverse voltage
VR
25
V
Average forward current
IO
0.7
A
Peak one cycle surge forward current
(non-repetitive)
IFSM
4 (50 Hz)
A
Junction temperature
Tj
125
°C
単位: mm
JEDEC
JEITA
TOSHIBA TOSHIBA
Weight:
mg (typ)
1:Anode
2:N/C
3:Source
4:Gate
5,6:Drain
7,8:Cathode
TENTATIVE
Maximum Ratings (Ta = 25°C) MOSFET, DIODE COMMON
Characteristics
Symbol
Rating
Unit
Storage temperature
Tstg
−55~125
°C
Operating temperature
Topr
(Note 3)
−40~85
°C
Note 1:
Mounted on FR4 board
(25.4 mm
× 25.4 mm × 1.6 t, Cu pad: 645 mm2)
Note 2:
The pulse width limited by max channel temperature.
Note 3:
Operating temperature limited by max channel temperature and max junction temperature.
Handling Precaution
When handling individual devices (which are not yet mounting on a circuit board), be sure that the
environment is protected against electrostatic discharge. Operators should wear anti-static clothing and use
containers and other objects that are made of anti-static materials.
The Channel-to-Ambient thermal resistance Rth (ch-a) and the drain power dissipation PD vary according to
the board material, board area, board thickness and pad area. When using this device, please take heat
dissipation fully into account.
2003-12-19
1


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