MX887P

6

www.ixysic.com

R01

3.5 Mechanical Dimensions

3.5.1 MX887PHT TSOT23 3-Lead Package

3.5.2 MX887PHTTR Tape & Reel Packaging

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

Recommended PCB Land Pattern

2.60 / 3.00

(0.102 / 0.118)

0.10 / 0.25

(0.004 / 0.010)

0.37 / 0.47

(0.015 / 0.019)

2.80 / 3.00

(0.110 / 0.118)

0.75 / 0.90

(0.030 / 0.035)

0.95 BSC

(0.037 BSC)

1.50 / 1.70

(0.059 / 0.067)

0.35 / 0.51

(0.014 / 0.020)

0.00 / 0.10

(0.000 / 0.004)

0.70 / 0.80

(0.028 / 0.031)

1.90 BSC

(0.0748 BSC)

0.60 REF

(0.0236 REF)

0.25 BSC

(0.0098 BSC)

0.10 MIN

(0.004 MIN)

5º NOM

7º NOM

0º / 8º

1

2

3

1.05

(0.041)

2.70

(0.106)

0.95

(0.037)

0.60

(0.024)

Notes: (Unless otherwise specified)

1. Dimension “D” does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm

(0.004 inches) per side.

2. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side.

3. Package top may be smaller than package bottom. Dimensions “D” and “E1” are determined at the outermost extreme of the plastic body

excluding mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between top and bottom of the plastic body.

E

E1

D

NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.066 MAX.

(0.003 MAX.)

178 DIA.

(7.01 DIA.)

Dimensions

mm

(inches)

K

(0.043 ± 0.004)

P=4.0 ± 0.1

(0.157 ± 0.004)

A

(0.126 ± 0.004)

B

(0.126 ± 0.004)

W=8.0 ± 0.2

(0.315 ± 0.008)

P=4.0 ± 0.1

(0.157 ± 0.004)

2.0 ± 0.05

(0.079 ± 0.002)

1.75 ± 0.1

(0.069 ± 0.004)

ø1.5, +0.1, -0

(ø0.059, +0.004, -0)

3.5 ± 0.05

(0.138 ± 0.002)

ø1.1 ± 0.1

(0.043 ± 0.004)

0.25 ± 0.05

(0.001 ± 0.002)

Specification: DS-MX887P-R01

©Copyright 2012, IXYS Integrated Circuits Division

All rights reserved. Printed in USA.

12/22/2012

For additional information please visit www.ixysic.com

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and

reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed

or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability

whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a

particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into

the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical

harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes

to its products at any time without notice.