UD06122G-K10-3030-R datasheet(7/10 Pages) UTC

7 / 10 page

UD06122

CMOS IC

UNISONICTECHNOLOGIESCO.,LTD

7 of 10

www.unisonic.com.tw

QW-R115-013 .A



APPLICATION INFORMATION (Cont.)

Thermal Considerations

The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of

surroundings airflow and temperature difference between junctions to ambient. The maximum power dissipation can

be calculated by following formula:

)

MAX

(

)

MAX

(

)

(

Where TJ (MAX) is the maximum junction temperature, TA is the ambient temperature and the θJA is the junction to

ambient thermal resistance. For recommended operating conditions specification of UTC UD06122 DC/DC converter,

where TJ (MAX) is the maximum junction temperature of the die and TA is the ambient temperature. The junction to

ambient thermal resistance θJA is layout dependent. For TDFN-10 (3x3) packages, the thermal resistance θJA is

60°C/W on the 1 in

2 Multi-layer PCB copper area (The IC exposed pad must be connected to the PCB Copper area)

two-layers thermal test board. The maximum power dissipation at TA=25°C can be calculated by following formula:

package

(3x3)

TDFN

for

2.2W

)

C/W

)

125

(

)

MAX

(

The maximum power dissipation depends on operating ambient temperature for fixed TJ (MAX) and thermal

resistance θJA.

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