LM4867 datasheet(5/26 Pages) NSC

5 / 26 page

Electrical Characteristics for Single-Ended Operation (Notes 3, 13) (Continued)

Note 20: See Application Information section ’Single-Ended Output Power Performance and Measurement Considerations’ for more information.

Typical Performance Characteristics

MTE- and LQ- Specific Characteristics

Note 21: This curve shows the LM4867MTE’s thermal dissipation ability at different ambient temperatures given these conditions:

500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across

it.

Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.

500LFPM + 2.5in2: The part is soldered to a 2.5in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.

2.5in2: The part is soldered to a 2.5in2, 1oz. copper plane.

Not Attached: The part is not soldered down and is not forced-air cooled.

LM4867MTE

THD+N vs Output Power

DS200013-33

LM4867MTE

THD+N vs Frequency

DS200013-34

LM4867LQ

THD+N vs Output Power

DS200013-53

LM4867LQ

THD+N vs Frequency

DS200013-54

LM4867MTE

THD+N vs Output Power

DS200013-36

LM4867LQ

THD+N vs Output Power

DS200013-55

LM4867LQ, LM4867MTE

Power Dissipation vs Power Output

DS200013-61

LM4867LQ, LM4867MTE(Note 21)

Power Derating Curve

DS200013-59

LM4867 Datasheet(PDF) 5 Page - National Semiconductor (TI)