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STS30 Datasheet(PDF) 12 Page - List of Unclassifed Manufacturers

Part # STS30
Description  Fully calibrated and linearized digital output
PDF  17 Pages
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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STS30 Datasheet(HTML) 12 Page - List of Unclassifed Manufacturers

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www.sensirion.com
November 2016 - Version 1
12/17
5 Packaging
STS3x-DIS sensors are provided in a dual flat no leads
(DFN) package.
The sensor chip is made of silicon and is mounted to a
lead frame. The latter is made of Cu plated with
Ni/Pd/Au. Chip and lead frame are overmolded by an
epoxy-based mold compound leaving the central die pad
and I/O pins exposed for mechanical and electrical
connection. Please note that the side walls of the sensor
are diced and therefore these diced lead frame surfaces
are not covered with the respective plating.
The package follows JEDEC publication 95, design
registration 4.20, small scale plastic quad and dual inline,
square and rectangular, No-LEAD packages (with
optional
thermal
enhancements)
small
scale
(QFN/SON), Issue D.01, September 2009.
STS3x-DIS has a Moisture Sensitivity Level (MSL) of 1,
according to IPC/JEDEC J-STD-020. At the same time,
it is recommended to further process the sensors within
1 year after date of delivery.
5.1
Traceability
All STS3x-DIS sensors are laser marked for easy
identification and traceability. The marking on the sensor
top side consists of a pin-1 indicator and two lines of text.
The top line consist of the pin-1 indicator which is located
in the top left corner and the product name. The small
letter x stands for the accuracy class.
The bottom line consists of 6 letters. The first two digits
XY (=DI) describe the output mode. The third letter (A)
represents the manufacturing year (4 = 2014, 5 = 2015,
etc). The last three digits (BCD) represent an
alphanumeric tracking code. That code can be decoded
by Sensirion only and allows for tracking on batch level
through production, calibration and testing – and will be
provided upon justified request.
If viewed from below pin 1 is indicated by triangular
shaped cut in the otherwise rectangular die pad. The
dimensions of the triangular cut are shown in Figure 7
through the labels T1 & T2.
Figure 6 Top View of the STS3x-DIS illustrating the laser
marking.



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