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PCA1603U/7 Datasheet(PDF) 9 Page - NXP Semiconductors |
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PCA1603U/7 Datasheet(HTML) 9 Page - NXP Semiconductors |
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9 / 16 page ![]() 1997 Dec 12 9 Philips Semiconductors Product specification 32 kHz watch circuits with EEPROM PCA16xx series CHIP DIMENSIONS AND BONDING PAD LOCATIONS Table 2 Bonding pad locations (dimensions in µm) All x/y coordinates are referenced to the centre of pad (VDD), see Fig.5. PAD x y VSS 1290 1100 TEST 940 1100 OSC IN 481 1100 OSC OUT −102 1100 VDD 00 M1 578 0 M2 930 0 RESET 1290 0 chip corner (max. value) −497.5 −170 Fig.5 Bonding pad locations, PCA16xxU series, 8 terminals. Chip area: 2.91 mm2. Bonding pad dimensions: 110 µm × 110 µm. Chip thickness: 200 ±25 µm, with bumps: 270 ±25 µm. MSA976 0 0 1.44 mm VDD M1 M2 RESET VSS TEST OSC IN OSC OUT y x 2.02 mm PCA16xxU SERIES |
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