Description: Giga-snaP BGA SMT Land Socket

272 position BGA surface mount land pattern to terminal pins (1.27mm [0.050"] centers, 20x20 array)

Status: Released

Drawing: S. Faiz

Scale: 4:1

Rev: A

Date: 11/20/12

Modified:

File: LS-BGA272A-31 Dwg

LS-BGA272A-31 Drawing

© 2012 IRONWOOD ELECTRONICS, INC.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.

1

Pins: material- Brass Alloy 360 1/2 hard; finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

FR4/G10 or equivalent high temp material.

2

Top View

Side View

2

1

27.00mm

27.00mm

1.44mm

1.44mm

1.27mm typ.

3.77mm

Ø 0.2032mm±0.0127mm

24.13mm

2.18mm 1.84mm