SN74LVC1G332

SINGLE 3INPUT POSITIVEOR GATE

SCES489C − SEPTEMBER 2003 − REVISED MARCH 2004

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

Operation

JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

The SN74LVC1G332 performs the Boolean function Y

+ A ) B ) CorY + A • B • C in positive logic.

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74LVC1G332YEPR

_ _ _CZ_

−40 C to 85 C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

Reel of 3000

SN74LVC1G332YZPR

_ _ _CZ_

−40

°C to 85°C

SOT (SOT-23) − DBV

Reel of 3000

SN74LVC1G332DBVR

C2C_

SOT (SOT-23) − DBV

Reel of 250

SN74LVC1G332DBVT

C2C_

SOT (SC-70) − DCK

Reel of 3000

SN74LVC1G332DCKR

CZ_

SOT (SC-70) − DCK

Reel of 250

SN74LVC1G332DCKT

CZ_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2004, Texas Instruments Incorporated

NanoStar and NanoFree are trademarks of Texas Instruments.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

6

5

4

A

GND

B

C

Y

3

2

1

4

5

6

B

GND

A

Y

C

YEP OR YZP PACKAGE

(BOTTOM VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.