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FEATURES

DCT OR DCU PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1A

3Y

2A

GND

1Y

3A

2Y

4

3

2

1

5

6

7

8

GND

2A

3Y

1A

2Y

3A

1Y

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74LVC3G07

TRIPLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUTS

SCES365H – AUGUST 2001 – REVISED JUNE 2005

•

Available in the Texas Instruments

NanoStar™ and NanoFree™ Packages

•

•

•

Low Power Consumption, 10-

µA Max I

CC

•

±24-mA Output Drive at 3.3 V

•

Input and Open-Drain Output Accepts

Voltages up to 5.5 V

•

•

•

Operation

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

SN74LVC3G07YEAR

0.17-mm Small Bump – YEA

NanoFree™ – WCSP (DSBGA)

SN74LVC3G07YZAR

0.17-mm Small Bump – YZA (Pb-free)

Reel of 3000

_ _ _CV_

NanoStar™ – WCSP (DSBGA)

SN74LVC3G07YEPR

0.23-mm Large Bump – YEP

–40°C to 85°C

NanoFree™ – WCSP (DSBGA)

SN74LVC3G07YZPR

0.23-mm Large Bump – YZP (Pb-free)

SSOP – DCT

Reel of 3000

SN74LVC3G07DCTR

C07_ _ _

Reel of 3000

SN74LVC3G07DCUR

VSSOP – DCU

C07_

Reel of 250

SN74LVC3G07DCUT

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2001–2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.