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MICRF008 Datasheet(PDF) 6 Page - Micrel Semiconductor |
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MICRF008 Datasheet(HTML) 6 Page - Micrel Semiconductor |
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6 / 12 page ![]() MICRF008 Micrel MICRF008 6 July 2003 Data Slicing Level Extraction of the DC value of the demodulated signal for purposes of logic-level data slicing is accomplished by an external capacitor C TH and the on-chip switched-capacitor resistor RSC, indicated in the block diagram. The effective resistance of RSC scales inversely proportional to REFOSC frequency. The nominal value of RSC given in the “ Electrical Characteristics ” Table is 220k Ω for a REFOSC frequency of 3.36MHz. Slicing level time constant value vary depending on data pattern, data rate and data duty cycle. Automatic Gain Control (AGC) The signal path has automatic gain control (AGC) to increase the overall receiver dynamic range. An external capacitor, C AGC, must be connected to the CAGC pin of the device. Normally the C AGC capacitor is connected to ground. If faster start-up times are required when the receiver is first powered- on, the C AGC capacitor may be connected to VDD. The ratio of decay-to-attack time constant is fixed at 10:1 (that is, the attack time constant is 1/10th of the decay time constant), and the user cannot change this ratio. Nevertheless, the attack time constant is set externally by choosing a value for C AGC. Another function of the AGC control voltage is to raise the noise floor in order to guarantee a clean signal between the preamble and the data, sometimes called dead time. The AGC control voltage can be further manipulated and ampli- fied to create an RSSI signal, which is useful for several different applications. Reference Oscillator All timing and tuning operations on the MICRF008BM are derived from the internal Colpitts reference oscillator. The reference frequency can be implemented in two ways, by using a resonator device (a ceramic resonator or crystal), or by driving an external signal, which should not exceed 0.5V RMS. The reference frequency is obtained by dividing the RF carrier frequency by 129. I/O Pin Interface Circuitry Interface circuitry for the various I/O pins of the MICRF008 is shown in Figures 1 through 6. Specific information regarding each of these circuits is discussed in the following sub- paragraphs. Not shown are ESD protection diodes which are applied to all input pins. C TH Pin Figure 2 illustrates the C TH pin interface circuit. CTH pin is driven from a P-Channel MOSFET source-follower biased with approximately 20 µA of bias current. Transmission gates TG1 and TG2 isolate the 3.3pF capacitor. Internal control signals PHI1/PHI2 are related in a manner such that the impedance across the transmission gates looks like a “resis- tance.” The DC potential on the C TH pin is approximately 2.2V, fundamentally determined by the VGS of the two P- Channel MOSFET source-followers shown. C AGC Pin Figure 3 illustrates the C AGC pin interface circuit. The AGC control voltage is developed as an integrated current into a capacitor C AGC. The attack current is nominally 15µA, while the decay current is a 1/10th scaling of this, approximately 1.5 µA. Signal gain of the RF/IF strip inside the IC diminishes as the voltage on C AGC decreases. By simply adding a capacitor to C AGC pin, the attack/decay time constant ratio is fixed at 1:10. VDDBB VSSBB Compa- rator 1.5 µA 15 µA CAGC Figure 3. C AGC Pin 3.3pF PHI2B TG1 TG2 PHI1B PHI1 PHI2 CTH DC-coupled Switched Cap. Filter VDDBB VSSBB VSSBB 20 µA VDDBB VSSBB 20 µA Demod Signal (0Vdc) Figure 2. C TH Pin |
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