THR-DS-TFLEX-SF800_07_2_14

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under any Laird Technologies or any third party intellectual property rights. Document A16822-00 Rev C

Thermal Gap Filler

STANDARD THICKNESSES

Standard thickness is 0.020-inch (0.50 mm) through 0.16-inch (4.064mm) in 0.010-inch increments

MATERIAL NAME AND THICKNESS

line with thickness in mils (0.001-inches).

EXAMPLES:

Tflex™ SF840 = standard 0.040-inch thick Tflex™ SF800 material.

Data for design engineer guidance only. Observed performance varies in application.

Engineers are reminded to test the material in application.

* Method detection limit = 40ppm

TEST METHOD

Construction

Ceramic-filled,

silicone-free gap filler

N/A

Color

Grey

Visual

Thermal Conductivity (W/mK)

7.8

Hot Disk

Thermal Resistance

0.19

ASTM D5470

(modified)

Thickness Range

(inches / mm)

0.020 - 0.160 /

0.051 - 4.064

Thickness Tolerance (%)

± 10

Density (g/cc)

3.21

Helium Pyncometer

Hardness (Shore 00)

81 ; 3 seconds

75 ; 30 seconds

ASTM D2240

Volatile Siloxane (D3-D10)

None detected*

GC/MS

Weight Loss over time

@ 120°C, 168 hrs (%)

< 0.2

TGA

Belcore (Telcordia)

Silicone Extraction

Pass

TR-NWT-000930

UL Flammability Rating (UL 94)

V0

File E180840

Continuous Use Temperature (°C)

-20 to 120

TGA

CTE (ppm/°C)

106.1; 25°C to 120°C

IPC-TM-650 2.4.24

Heat Capacity at 50°C (J/g-K)

0.8

MDSC

Volume Resistivity (ohm-cm)

ASTM D257

Dielectric Constant

@ 1 kHz

@ 1 MHz

16.6

15.9

ASTM D150

Dissipation Factor

@ 1 kHz

@ 1 MHz

0.09

0.03

ASTM D150

Percent Deflection vs Pressure

Thermal Resistance vs Pressure

Pressure (psi)

Pressure (psi)