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LMH6702MF Datasheet(PDF) 11 Page - National Semiconductor (TI) |
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LMH6702MF Datasheet(HTML) 11 Page - National Semiconductor (TI) |
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11 / 13 page ![]() Application Section (Continued) DC ACCURACY AND NOISE Example below shows the output offset computation equa- tion for the non-inverting configuration using the typical bias current and offset specifications for A V =+2: Output Offset : V O =(±IBN ·RIN ± VIO)(1+RF/RG) ± IBI ·RF Where R IN is the equivalent input impedance on the non- inverting input. Example computation for A V = +2, RF = 237 Ω,R IN =25 Ω: V O =(±6µA · 25 Ω ± 1mV) (1 + 237/237) ± 8µA · 237 = ±4.20mV A good design, however, should include a worst case calcu- lation using Min/Max numbers in the data sheet tables, in order to ensure "worst case" operation. Further improvement in the output offset voltage and drift is possible using the composite amplifiers described in Appli- cation Note OA-7. The two input bias currents are physically unrelated in both magnitude and polarity for the current feedback topology. It is not possible, therefore, to cancel their effects by matching the source impedance for the two inputs (as is commonly done for matched input bias current devices). The total output noise is computed in a similar fashion to the output offset voltage. Using the input noise voltage and the two input noise currents, the output noise is developed through the same gain equations for each term but com- bined as the square root of the sum of squared contributing elements. See Application Note OA-12 for a full discussion of noise calculations for current feedback amplifiers. PRINTED CIRCUIT LAYOUT Generally, a good high frequency layout will keep power supply and ground traces away from the inverting input and output pins. Parasitic capacitances on these nodes to ground will cause frequency response peaking and possible circuit oscillations (see Application Note OA-15 for more information). National Semiconductor suggests the following evaluation boards as a guide for high frequency layout and as an aid in device testing and characterization: Device Package Evaluation Board Part Number LMH6702MF SOT23-5 CLC730216 LMH6702MA SOIC CLC730227 These free evaluation boards are shipped when a device sample request is placed with National Semiconductor. www.national.com 11 |
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