LMX2332LSLB datasheet(19/21 Pages) NSC

19 / 21 page

Application Information (Continued)

between 1X and 4X values. This is accomplished by increas-

ing the charge pump output current from 1 mA in the stan-

dard mode to 4 mA in Fastlock.

FASTLOCK CIRCUIT IMPLEMENTATION

A diagram of the Fastlock scheme as implemented in Na-

tional Semiconductors LMX233XL PLL is shown in

Figure 5.

When a new frequency is loaded, and the RF Icp

o bit is set

high the charge pump circuit receives an input to deliver 4

times the normal current per unit phase error while an open

drain NMOS on chip device switches in a second R2 resistor

element to ground. The user calculates the loop filter compo-

nent values for the normal steady state considerations. The

device configuration ensures that as long as a second iden-

tical damping resistor is wired in appropriately, the loop will

lock faster without any additional stability considerations to

account for. Once locked on the correct frequency, the user

can return the PLL to standard low noise operation by send-

ing a MICROWIRE instruction with the RF Icp

o bit set low.

This transition does not affect the charge on the loop filter

capacitors and is enacted synchronous with the charge

pump output. This creates a nearly seamless change be-

tween Fastlock and standard mode.

DS012806-17

FIGURE 4. Open Loop Response Bode Plot

DS012806-18

FIGURE 5. Fastlock PLL Architecture

LMX2332LSLB Datasheet(PDF) 19 Page - National Semiconductor (TI)