VS-VSKCS209 datasheet(2/6 Pages) VISHAY

2 / 6 page

VS-VSKCS209/150

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Vishay Semiconductors

Revision: 28-Sep-15

Document Number: 93229

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

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ABSOLUTE MAXIMUM RATINGS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum average



forward current

per module

IF(AV)

50 % duty cycle at TC = 113 °C, rectangular waveform

200

per leg

100

Maximum peak one cycle



non-repetitive surge current

IFSM

5 μs sine or 3 μs rect. pulse

Following any rated

load condition and with

rated VRRM applied

11 300

10 ms sine or 6 ms rect. pulse

1600

Non-repetitive avalanche energy

EAS

TJ = 25 °C, IAS = 1.8 A, L = 10 mH

Repetitive avalanche current

IAR

Current decaying linearly to zero in 1 μs



Frequency limited by TJ maximum VA = 1.5 x VR typical

ELECTRICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum forward voltage drop

VFM

100 A

TJ = 25 °C

1.01

200 A

1.35

100 A

TJ = 125 °C

0.85

200 A

1.13

Maximum reverse leakage current

IRM

TJ = 25 °C

VR = Rated VR

TJ = 125 °C

Maximum junction capacitance

VR = 5 VDC (test signal range 100 kHz to 1 MHz), 25 °C

3000

Typical series inductance

Measured lead to lead 5 mm from package body

7.0

Maximum voltage rate of change

dV/dt

Rated VR

10 000

V/μs

Maximum RMS insulation voltage

VINS

50 Hz

3000 (1 min)

3600 (1 s)

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum junction and storage



temperature range

TJ, TStg

-55 to +175

°C

Maximum thermal resistance,



junction to case per leg

RthJC

DC operation

0.52

°C/W

Typical thermal resistance,



case to heatsink per module

RthCS

0.1

Approximate weight

2.7

oz.

Mounting torque ± 10 %

to heatsink

A mounting compound is recommended and the torque

should be rechecked after a period of 3 hours to allow for

the spread of the compound.

busbar

Case style

JEDEC®

TO-240AA compatible

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