F1206B3R00FWSLASHSTR datasheet(2/17 Pages) AVX

2 / 17 page

Accu-Guard® II

SMD Thin-Film Fuse

Test

Conditions

Requirement

Solderability

Components completely immersed in a

Terminations to be well tinned

solder bath at 235 ±5°C for 2 secs.

No visible damage

Leach Resistance

Completely immersed in a solder bath

Dissolution of termination

at 260 ±5°C for 60 secs.

≤ 25% of area

ΔR/R<10%

Storage

12 months minimum with components

Good solderability

stored in “as received” packaging.

Shear

Components mounted to a substrate.

No visible damage

A force of 5N applied normal to the

line joining the terminations and in

a line parallel to the substrate.

Rapid Change of

Components mounted to a substrate.

No visible damage

Temperature

50 cycles -55°C to +125°C.

Δ R/R<10%

Vibration

Per Mil-Std-202F

No visible damage

Method 201A and

ΔR/R<10%

Method 204D Condition D.

Bend

Tested as shown in diagram

No visible damage

ΔR/R<10%

Load Life

25°C, rated current, 20,000 hrs.

No visible damage

F0805B, F1206B

ΔR/R<10%

ENVIRONMENTAL CHARACTERISTICS

45mm

3 mm

Deflection

F1206B3R00FW/STR Datasheet(PDF) 2 Page - AVX Corporation

F1206B3R00FW/STR Datasheet(HTML) 2 Page - AVX Corporation

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