DocID025035 Rev 5

7/12

BALF-SPI-01D3

Package information

3

Package information



Epoxy meets UL94, V0



Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

3.1

Flip-Chip package information

Figure 15. Flip-Chip package outline

Table 4. Flip-Chip package mechanical data

Parameter

Description

Min.

Typ.

Max.

Unit

A

Bump height + substrate thickness

0.590

0.650

0.710

mm

A1

Bump height

0.200

mm

A2

Substrate thickness

0.400

mm

b

Bump diameter

0.210

0.250

0.290

mm

D

Y dimension of the die

1.950

2.000

1.950

mm

D1

Y pitch

0.960

1.000

1.040

mm

D2

Y pitch2

0.460

0.500

0.540

mm

E

X dimension of the die

1.350

1.400

1.450

mm

E1

X pitch

0.790

0.820

0.850

mm

fD1

Distance from bump to edge of die on Y

axis

0.295

mm

fD2

Distance from bump to edge of die on Y

axis

0.195

mm

ccc

0.05

mm