STPS30120DJF datasheet(4/7 Pages) STMICROELECTRONICS

4 / 7 page

Characteristics

STPS30120DJF

4/7

Doc ID 15671 Rev 5

Figure 7.

Reverse leakage current versus

reverse voltage applied (typical

values)

Figure 8.

Junction capacitance versus

reverse voltage applied (typical

values)

IR(mA)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1020

30405060

708090

100

110

120

j=150°C

j=125°C

j=25°C

j=100°C

j=75°C

j=50°C

VR(V)

C(pF)

100

1000

10000

110

100

1000

F=1MHz

osc=30mVRMS

j=25°C

VR(V)

Figure 9.

Forward voltage drop versus

forward current

Figure 10.

Thermal resistance junction to

ambient versus copper surface

under tab

IFM(A)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

j=25°C

(Maximum values)

j=125°C

(Maximum values)

j=125°C

(Maximum values)

j=125°C

(Typical values)

j=125°C

(Typical values)

VFM(V)

100

150

200

250

2345

678

th(j-a)(°C/W)

SCu(cm²)

Epoxy printed circuit board FR4,

copper thickness = 35 µm

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