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STD3N40K3 Datasheet(PDF) 3 Page - STMicroelectronics |
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STD3N40K3 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 16 page ![]() STD3N40K3 Electrical ratings Doc ID 023398 Rev 1 3/16 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage 400 V VGS Gate- source voltage ± 30 V ID Drain current (continuous) at TC = 25 °C 2 A ID Drain current (continuous) at TC = 100 °C 1.2 A IDM (1) 1. Pulse width limited by safe operating area. Drain current (pulsed) 8.0 A PTOT Total dissipation at TC = 25 °C 30 W IAR Avalanche current, repetitive or not- repetitive (pulse width limited by Tj max) 1A EAS Single pulse avalanche energy (starting Tj = 25°C, ID = IAR, VDD = 50 V) 45 mJ VESD(G-S) Gate source ESD(HBM-C = 100 pF, R = 1.5 k Ω) 2500 V dv/dt (2) 2. ISD < 2 A, di/dt = 400 A/µs, VDD = 80% V(BR)DSS, VDS peak ≤ V(BR)DSS. Peak diode recovery voltage slope 12 V/ns Tstg Storage temperature - 55 to 150 °C Tj Max. operating junction temperature °C Table 3. Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 4.17 °C/W Rthj-pcb Thermal resistance junction-pcb max 50 °C/W |
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