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STF17N62K3 Datasheet(PDF) 3 Page - STMicroelectronics

Part # STF17N62K3
Description  Very low intrinsic capacitance
PDF  17 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STF17N62K3 Datasheet(HTML) 3 Page - STMicroelectronics

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STF17N62K3, STP17N62K3, STW17N62K3
Electrical ratings
Doc ID 15046 Rev 2
3/17
1
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
TO-220
TO-247
TO-220FP
VDS
Drain-source voltage (VGS = 0)
620
V
VGS
Gate- source voltage
± 30
V
ID
Drain current (continuous) at TC = 25 °C
15.5
15.5 (1)
1.
Limited only by temperature allowed.
A
ID
Drain current (continuous) at TC = 100 °C
10
10 (1)
A
IDM
(2)
2.
Pulse width limited by safe operating area.
Drain current (pulsed)
62
62 (1)
A
PTOT
Total dissipation at TC = 25 °C
190
40
W
IAR
(3)
3.
Pulse width limited by Tj max.
Avalanche current, repetitive or not-
repetitive
15.5
A
EAS
(4)
4.
Starting Tj = 25°C, ID = IAR, VDD = 50V.
Single pulse avalanche energy
260
mJ
Derating factor
1.52
0.32
W/°C
dv/dt (5)
5.
ISD ≤ 15.5 A, di/dt ≤ 400 A/µs, VDD = 80% V(BR)DSS, VDS peak < V(BR)DSS.
Peak diode recovery voltage slope
9
V/ns
VISO
Insulation withstand voltage (RMS) from all
three leads to external heat sink
(t = 1 s; TC = 25 °C)
2500
V
Tstg
Storage temperature
-55 to 150
°C
Tj
Max. operating junction temperature
150
°C
Table 3.
Thermal data
Symbol
Parameter
TO-220FP
TO-220
TO-247
Unit
Rthj-case Thermal resistance junction-case max
3.13
0.66
°C/W
Rthj-amb Thermal resistance junction-ambient max
62.5
50
°C/W
Tl
Maximum lead temperature for soldering
purpose
300
°C



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