STM32L062T8 datasheet(100/118 Pages) STMICROELECTRONICS

100 / 118 page

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STM32L062x8

100/118

DocID025937 Rev 8

Figure 33. Standard WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale

recommended footprint

Table 72. Standard WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale

mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to the 3rd decimal place.

Min

Typ

Max

Min

Typ

Max

A-

0.59

0.023

0.18

0.007

0.38

0.015

0.025(2)

2. Nominal dimension rounded to the 3rd decimal place results from process capability.

0.001

0.22

0.25

0.28

0.009

0.010

0.011

2.59

2.61

2.63

0.102

0.103

0.104

2.86

2.88

2.90

0.112

0.113

0.114

0.40

0.016

2.00

0.079

2.00

0.079

F-

0.305(3)

3. Calculated dimensions are rounded to the 3rd decimal place.

0.012

G-

0.440(3)

0.017

aaa

0.100

0.004

bbb

0.100

0.004

ccc

0.100

0.004

ddd

0.050

0.002

eee

0.050

0.002

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