STM32L151XE datasheet(132/134 Pages) STMICROELECTRONICS

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Revision History

STM32L151xE STM32L152xE

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DocID025433 Rev 8

Revision History

Table 73. Document revision history

Date

Revision

Changes

31-Oct-2013

Initial release.

19-Feb-2014

Added Input Voltage in Table 13: General operating conditions

Updated: Chapter 2.2: Ultra-low-power device continuum, Table 13:

General operating conditions, Table 28: Current consumption in Low-

power run mode, Table 21: Current consumption in Low-power sleep

mode, Table 48: Flash memory and data EEPROM endurance and

retention, Table 77: ADC characteristics, Table 78: ADC accuracy

Updated Ultra-Low-power Feature inside Cover Page

Updated: Table 28: Current consumption in Low-power run mode,

Table 21: Current consumption in Low-power sleep mode, Table 22:

Typical and maximum current consumptions in Stop mode, Table 23:

Typical and maximum current consumptions in Standby mode,

Table 38: High-speed external user clock characteristics, Figure 12:

High-speed external clock source AC timing diagram, Table 39: Low-

speed external user clock characteristics, Figure 13: Low-speed

external clock source AC timing diagram, Table 78: ADC

accuracy,Table 57: EMS characteristics, Table 58: EMI characteristics,

Table 59: ESD absolute maximum ratingsTable 60: Electrical

sensitivities, Table 63: I/O static characteristics, Table 66: NRST pin

characteristics. Added WLCSP104, 0.4 mm pitch wafer level chip scale

package recommended footprint for package WLCSP104, removed

figures “Power supply and reference decoupling (VREF+ not connected

to VDDA) and “Power supply and reference decoupling (VREF+

connected to VDDA). Updated current consumption values.

21-Feb-2014

Ultra low power features modification inside Cover page. Updated

Table 4: Functionalities depending on the working mode (from

Run/active down to standby), Table 80: DAC characteristics

16-May-2014

Updated IIO in Table 11: Current characteristics.

Removed note 4 in Table 61: Temperature sensor characteristics.

Added Table 41: UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch

ball grid array package recommended footprint..

Modified pins F9 for WLCSP104 package inside Table 8:

STM32L151xE and STM32L152xE pin definitions

13-Oct-2014

Updated Section 3.17: Communication interfaces putting I2S

characteristics inside.

Updated DMIPS features in cover page and Section 2: Description.

Updated max temperature at 105°C instead of 85°C in the whole

datasheet.

Updated current consumption in Table 19: Current consumption in

Sleep mode.

Updated Table 24: Peripheral current consumption with new measured

current values.

Updated Table 57: Maximum source impedance RAIN max adding

note 2.

STM32L151XE Datasheet(PDF) 132 Page - STMicroelectronics

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