Package information

ESDAULC6-8F3

6/8

Doc ID 16859 Rev 2

Figure 16.

Flip Chip tape and reel specification

Note:

More packing information is available in the application notes:

AN2348: "Flip Chip: Package description and recommendations for use"

AN1751: "EMI Filters: Recommendations and measurements"

Figure 14.

Footprint

Figure 15.

Marking

Copper pad diameter:

220 µm recommended, 260 µm max

Solder mask opening:

300 µm minimum

Solder stencil opening:

220 µm recommended

x

y

x

w

z

w

Dot, ST logo

xx = maring

z = manufacturing location

yww = datecode

(y = year

ww = week)

ECOPACK ® Grade

User direction of unreeling

All dimensions in mm

4.0 ± 0.1

4.0 ± 0.1

Ø 1.5 ± 0.1

0.69 ± 0.05

1.30

Dot identifyng Pin A1 location