3. Packaging and layout information

3.1. Mechanical dimensions

The center of the effective pixel-field (320x240) is positioned with respect to the center of CSP pin 1 (XSYNC_SAT_CFG) with an offset of

4'900µm by 4'000µm (x,y). This point corresponds to intersection of middle of columns C163 - C164 and middle of rows R125 - R126 when

mapped to pixel-field coordinate system on the die (see Figure 30).

The packaging technology is chip scale packaging (CSP).

1

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(0.330)

0.500

4.900

9.68 +0.00/-0.08

9.000 (19 bumps with 0.5mm pitch)

6.400

R6

R245

Photosensitive area:

on top side,

320 x 240 pixel

Pin 1

Top side view

0.185 ±0.025

(0.050)

Pixel size:

20μm x 20μm

column

Figure 8: Mechanical dimensions

Notes:

■

■ all measures in mm

■ not specified tolerances: ±0.001mm

■ Dimensions in brackets: informal only

■ Top side is illumination side

© 2017 ESPROS Photonics Corporation

Characteristics subject to change without notice

15 / 116

Datasheet_epc660-V1.09

www.espros.com