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SW20N03A Datasheet(PDF) 1 Page - Xian Semipower Electronic Technology Co., Ltd. |
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SW20N03A Datasheet(HTML) 1 Page - Xian Semipower Electronic Technology Co., Ltd. |
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1 / 6 page ![]() Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved. Nov. 2016. Rev. 2.0 1/6 SW20N03A Absolute maximum ratings Symbol Parameter Value Unit V DSS Drain to source voltage 30 V I D Continuous drain current (@T C=25 oC) 5.7* A Continuous drain current (@T C=100 oC) 3.6* A I DM Drain current pulsed (note 1) 23 A V GS Gate to source voltage ± 20 V E AS Single pulsed avalanche energy (note 2) 41 mJ E AR Repetitive avalanche energy (note 1) 3 mJ dv/dt Peak diode recovery dv/dt (note 3) 5 V/ns P D Total power dissipation (@T C=25 oC) 1.5 W Derating factor above 25oC 0.01 W/oC T STG, TJ Operating junction temperature & storage temperature -55 ~ + 150 oC Thermal characteristics Symbol Parameter Value Unit R thja Thermal resistance, Junction to ambient 86 oC/W *. Drain current is limited by junction temperature. Order Codes Item Sales Type Marking Package Packaging 1 SW H 20N03A SW20N03A DFN3*3 REEL N-channel Enhanced mode DFN3*3 MOSFET Features High ruggedness Low R DS(ON) (Typ 19mΩ)@VGS=10V (Typ 23m Ω)@V GS=4.5V Low Gate Charge (Typ 14nC) Improved dv/dt Capability 100% Avalanche Tested Application:DC-DC Converter,Inverter, Synchronous Rectification General Description This power MOSFET is produced with advanced technology of SAMWIN. This technology enable the power MOSFET to have better characteristics, including fast switching time, low on resistance, low gate charge and especially excellent avalanche characteristics. BV DSS :30 V I D : 5.7A R DS(ON) : 19mΩ@VGS=10V 23m Ω@V GS=4.5V G(4) D(5,6,7,8) S(1,2,3) DFN3*3 Note: R thja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is d efined as the solder mounting surface of the drain pins. R thjc is guaranteed by design while Rthca is determined by the user's board design. 86oC/W on a 1 in2 pad of 2oz copper. |
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