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OPA187, OPA2187, OPA4187

www.ti.com

SBOS807 – DECEMBER 2016

Product Folder Links: OPA187 OPA2187 OPA4187

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should

be current limited to ±10 mA or less.

(3)

Refer to the Electrical Overstress section for more information.

(4)

Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5 V beyond the supply rails

should be current limited to ±55 mA or less.

(5)

Short-circuit to ground, one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage

40

V

Common-mode

±0.5

Current

–10

10

mA

–55

55

mA

Continuous

Continuous

Continuous

Temperature

–55

150

°C

150

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

4.5 (±2.25)

36 (±18)

V

Specified temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPAx187

OPAx187

UNIT

8 PINS

DGK (VSSOP)

Junction-to-ambient thermal resistance

159

°C/W

Junction-to-case (top) thermal resistance

37

°C/W

Junction-to-board thermal resistance

49

°C/W

Junction-to-top characterization parameter

1.2

°C/W

Junction-to-board characterization parameter

77.1

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W