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HT46R004 Datasheet(PDF) 9 Page - Holtek Semiconductor Inc

Part # HT46R004
Description  Cost-Effective A/D 8-Bit OTP MCU
PDF  84 Pages
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Manufacturer  HOLTEK [Holtek Semiconductor Inc]
Direct Link  http://www.holtek.com
Logo HOLTEK - Holtek Semiconductor Inc

HT46R004 Datasheet(HTML) 9 Page - Holtek Semiconductor Inc

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Rev. 1.30
8
�an�a�� ��� �01�
Rev. 1.30
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HT46R004
Cost-Effective A/D 8-Bit OTP MCU
A.C. Characteristics
Ta=�5°C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
VDD
Conditions
fSYS
Ope�ating Clock
—
�.3V~5.5V
8
8
8
MHz
fHIRC
S�stem Clock (HIRC)
3/5V
—
-�%
8
+�%
MHz
3/5V
Ta=0°~70°C
-5%
8
+5%
MHz
3.0~5.5V Ta=0°~70°C
-8%
8
+8%
MHz
3.0~5.5V Ta=-40°~85°C
-1�%
8
+1�%
MHz
fTIMER
Time� I/P F�eq�enc� (TMR)
3.3~5.5V
—
0
—
8
MHz
tWDTOSC Watchdog oscillato� pe�iod
3V
—
45
�0
180
μs
5V
—
3�
�5
130
μs
tRES
Exte�nal �eset low p�lse width
—
—
1
—
—
μs
tRESE
External reset low pulse width (with filter)
—
—
—
150
—
ns
tSST
S�stem sta�t-�p time� pe�iod
—
wake-�p f�om halt
—
1�
—
tSYS
tLVR
Low Voltage Width to Reset
—
—
0.�5
1
�
ms
tRSTD
S�stem Reset Dela� Time (All Reset)
—
—
�5
50
100
ms
Note:1.tSYS=1/fSYS
2.TomaintaintheaccuracyoftheinternalHIRCoscillatorfrequency,a0.1μFdecouplingcapacitorshould
beconnectedbetweenVDDandVSSandlocatedasclosetothedeviceaspossible.
A/D Converter Characteristics
Ta=�5°C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
VDD
Conditions
AVDD
Analog ope�ating voltage
—
VREF=VDD
�.7
—
5.5
V
VAD
AD Inp�t Voltage
—
—
0
—
AVDD/VREF
V
DNL
A/D Diffe�ential Non-linea�it�
�.7V
VREF=VDD=AVDD
tAD=0.5μs
-�
—
+�
LSB
3V
5V
INL
A/D Integ�al non-linea�it�
�.7V
VREF=VDD=AVDD
tAD=0.5μs
-4
—
+4
LSB
3V
5V
IADC
Additional Powe� Cons�mption if
A/D Conve�te� is Used
3V
No load (tAD=0.5μs)
—
0.5
—
mA
5V
—
0.�
—
mA
tAD
A/D Conve�te� Clock Pe�iod
�.7V~5.5V
—
0.5
—
10
μs
tADC
A/D Conve�sion Time
(Incl�de Sample and Hold Time) �.7V~5.5V 1�-bit ADC
—
1�
—
tAD
tON�ST
A/D Conve�te� On-to-Sta�t Time �.7V~5.5V
—
�
—
—
μs
Note:ADCconversiontime(tAD)=n(bitsADC)+4(samplingtime),theconversionforeachbitneedsoneADC
clock(tAD).



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