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ADG3247 Datasheet(PDF) 11 Page - Analog Devices |
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ADG3247 Datasheet(HTML) 11 Page - Analog Devices |
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11 / 12 page ![]() PRELIMINARY TECHNICAL DATA REV. PrD ADG3247 –11– OUTLINE DIMENSIONS 40-Lead Frame Chip Scale Package [LFCSP] (CP-40) Dimensions shown in millimeters 1 40 10 11 31 30 21 20 BOTTOM VIEW 4.25 3.70 SQ 1.75 TOP VIEW 6.00 BSC SQ PIN 1 INDICATOR 5.75 BSC SQ 12 MAX 0.30 0.23 0.18 0.20 REF SEATING PLANE 1.00 0.90 0.80 0.05 MAX 0.02 NOM COPLANARITY 0.08 1.00 MAX 0.65 NOM 4.50 REF 0.50 0.40 0.30 0.50 BSC PIN 1 INDICATOR 0.60 MAX 0.60 MAX COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2 38-Lead Thin Shrink Small Outline Package [TSSOP] (RU-38) Dimensions shown in millimeters 38 20 19 1 9.80 9.70 9.60 PIN 1 SEATING PLANE 0.15 0.05 0.50 BSC 1.20 MAX 0.27 0.17 0.20 0.09 8 0 4.50 4.40 4.30 6.40 BSC 0.70 0.60 0.45 COMPLIANT TO JEDEC STANDARDS MO-153BD-1 COPLANARITY 0.10 |
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