SPE-11-8-092/D Page 18 of 19

10. Recommended Reflow Temperature

Profile

1. Time shown in the above figures is measured from the point when chip

surface reaches temperature.

2. Temperature difference in high temperature part should be within

110°C.

3. After soldering, do not force cool, allow the parts to cool gradually.

*General attention to soldering:

●High soldering temperatures and long soldering times can cause leaching of

the termination, decrease in adherence strength, and the change of

characteristic may occur.

● For soldering, please refer to the soldering curves above. However, please

keep exposure to temperatures exceeding 200°C to under 50 seconds.

● Please use a mild flux (containing less than 0.2wt% Cl). Also, if the flux is

water soluble, be sure to wash thoroughly to remove any residue from the

underside of components that could affect resistance.