TLC2272MFKB datasheet(5/36 Pages) TI1

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TLC2272M-MIL

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SLOS983 – JUNE 2017

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to the midpoint between VDD+ and VDD–.

(3)

Differential voltages are at IN+ with respect to IN–. Excessive current will flow if input is brought below VDD– – 0.3 V.

(4)

The output may be shorted to either supply. Temperature or supply voltages must be limited to ensure that the maximum dissipation

rating is not exceeded.

6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, VDD+

(2)

VDD–

(2)

–8

Differential input voltage, VID

(3)

±16

Input voltage, VI (any input)

(2)

VDD− − 0.3

VDD+

Input current, II (any input)

±5

Output current, IO

±50

Total current into VDD+

±50

Total current out of VDD–

±50

Duration of short-circuit current at (or below) 25°C(4)

Unlimited

Operating ambient temperature range, TA

–55

125

Storage temperature, Tstg

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human-body model (HBM), per AEC

Q100-002(1)

Devices in D packages

±2000

Charged-device model (CDM), per

AEC Q100-011

Devices in D packages

±1000

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VDD±

Supply voltage

±2.2

±8

Input voltage

VDD−

VDD+ − 1.5

VIC

Common-mode input voltage

VDD−

VDD+ − 1.5

Operating ambient temperature

–55

125

°C

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2)

Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) − TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

(3)

The package thermal impedance is calculated in accordance with JESD 51-7 (plastic) or MIL-STD-883 Method 1012 (ceramic).

6.4 Thermal Information

THERMAL METRIC(1)

TLC2272M-MIL

UNIT

D (SOIC)

JG (CDIP)

FK (LCCC)

U (CFP)

8-PIN

20-PIN

10-PIN

RθJA

Junction-to-ambient thermal resistance (2)(3)

115.6

—

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance (2)(3)

61.8

121.3

°C/W

RθJB

Junction-to-board thermal resistance

55.9

—

°C/W

ψJT

Junction-to-top characterization parameter

14.3

—

°C/W

ψJB

Junction-to-board characterization parameter

55.4

—

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

8.68

°C/W

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