TMP303ADRLR datasheet(12/22 Pages) TI1

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TMP303

HYSTSET0

HYSTSET1

SOH

GND

OUT

OUTPUT

1.4 V to 3.6 V

0.1 F

TMP303

SBOS486G – JULY 2009 – REVISED JULY 2017

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Product Folder Links: TMP303

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The TMP303 family of devices is simple to configure. The TMP303 contains an active high, push-pull output

stage and does not require a pullup resistor to VS for proper operation. The only external component that the

device requires is a bypass capacitor. TI strongly recommends using a 0.1-µF capacitor, placed as close as

possible to the supply pin.

9.2 Typical Applications

9.2.1 TMP303 Typical Configuration

Figure 13 shows the typical circuit configuration for the TMP303 family of devices. These devices have

preprogrammed trip-points. Select the TMP303 device that meets the application temperature trip requirement.

Figure 13. TMP303 Typical Application Configuration Schematic

9.2.1.1 Design Requirements

The TMP303 is a temperature switch commonly used to signal a microprocessor in the event of an over or under

temperature condition. The temperature that the TMP303 issues a output is determined by the device preset trip

window. The TMP303 issues an output when the temperature threshold is exceeded. To avoid the TMP303

signaling the microprocessor as soon as the temperature drops below the temperature threshold the TMP303

has a built-in hysteresis. The amount of hysteresis is determined by the hysteresis pins, HYSTSET0 and

HYSTSET1 . These pins are digital inputs and must be tied either high or low, according to Table 1.

9.2.1.2 Detailed Design Procedure

Select the appropriate TMP303 device that matches the application requirements; see the Device Options table

for different trip point ranges. Connect the HYSTSET0 and HYSTSET1 pins according to the application

requirements; see Table 1. In Figure 13 the TMP303 device is configured with a 1°C hysteresis window (that is,

HYSTSET0 = HYSTSET1 = GND). Place a 0.1-µF bypass capacitor close to the TMP303 device to reduce the noise

coupled from the power supply.

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