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LM3670 Datasheet(PDF) 15 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # LM3670
Description  Miniature Step-Down DC-DC Converter for Ultra Low Voltage Circuits
PDF  17 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM3670 Datasheet(HTML) 15 Page - National Semiconductor (TI)

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Application Information (Continued)
BOARD LAYOUT CONSIDERATIONS
PC board layout is an important part of DC-DC converter
design. Poor board layout can disrupt the performance of a
DC-DC converter and surrounding circuitry by contributing to
EMI, ground bounce, and resistive voltage loss in the traces.
These can send erroneous signals to the DC-DC converter
IC, resulting in poor regulation or instability.
Good layout for the LM3670 can be implemented by follow-
ing a few simple design rules, as illustrated in .
1.
Place the LM3670 on TBDmil (TBD/1000 in.) pads.
Place the LM3670, inductor and filter capacitors close
together and make the traces short. The traces between
these components carry relatively high switching cur-
rents and act as antennas. Following this rule reduces
radiated noise. Place the capacitors and inductor within
0.2 in. (5 mm) of the LM3670.
2.
Arrange the components so that the switching current
loops curl in the same direction. During the first half of
each cycle, current flows from the input filter capacitor,
through the LM3670 and inductor to the output filter
capacitor and back through ground, forming a current
loop. In the second half of each cycle, current is pulled
up from ground, through the LM3670 by the inductor, to
the output filter capacitor and then back through ground,
forming a second current loop. Routing these loops so
the current curls in the same direction prevents mag-
netic field reversal between the two half-cycles and re-
duces radiated noise.
3.
Connect the ground pins of the LM3670, and filter ca-
pacitors together using generous component-side cop-
per fill as a pseudo-ground plane. Then, connect this to
the ground-plane (if one is used) with several vias. This
reduces ground-plane noise by preventing the switching
currents from circulating through the ground plane. It
also reduces ground bounce at the LM3670 by giving it
a low-impedance ground connection.
4.
Use wide traces between the power components and for
power connections to the DC-DC converter circuit. This
reduces voltage errors caused by resistive losses across
the traces.
5.
Route noise sensitive traces, such as the voltage feed-
back path, away from noisy traces between the power
components. The voltage feedback trace must remain
close to the LM3670 circuit and should be direct but
should be routed opposite to noisy components. This
reduces EMI radiated onto the DC-DC converter’s own
voltage feedback trace.
6.
Place noise sensitive circuitry, such as radio IF blocks,
away from the DC-DC converter, CMOS digital blocks
and other noisy circuitry. Interference with noise-
sensitive circuitry in the system can be reduced through
distance.
20075831
FIGURE 6. Board Layout Design Rules for the LM3670
www.national.com
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