AX−SFUS, AX−SFUS−API

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18

QFN40 Soldering Profile

Figure 6. QFN40 Soldering Profile

Preheat

Reflow

Cooling

Time

25

°C

Table 12.

Profile Feature

Pb−Free Process

Average Ramp−Up Rate

3

°C/s max.

Preheat Preheat

Temperature Min

150

°C

Temperature Max

200

°C

60 – 180 sec

Time 25

°C to Peak Temperature

8 min max.

Reflow Phase

Liquidus Temperature

217

°C

Time over Liquidus Temperature

60 – 150 s

Peak Temperature

260

°C

Time within 5

°C of actual Peak Temperature

20 – 40 s

Cooling Phase

Ramp−down rate

6

°C/s max.

1. All temperatures refer to the top side of the package, measured on the the package body surface.