RECOMMENDED SOLDERING CONDITIONS

EXCLUSIVE NORTH AMERICAN AGENT FOR

RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS

CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279

24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM

06/27/2002

DATA SUBJECT TO CHANGE WITHOUT NOTICE

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected

to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL

for all damages resulting from such improper use or sale.

(1) Infrared reflow soldering

• Peak reflow temperature

235 ûC or below (package surface temperature)

• Time of temperature higher than 210 ºC

30 seconds or less

•

Number of reflows

Two

•

Flux

Rosin flux containing small amount of chlorine (The flux with a maximum

chlorine content of 0.2 Wt % is recommended.)

(2) Dip soldering

• Temperature

260° or below (package surface temperature)

• Time

10 seconds or less

• Number of times

One

• Flux

Rosin flux containing small amount of chlorine (The flux with a maximum

chlorine content of 0.2 Wt % is recommended).

(3) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

Time (s)

100 to 160

60 to 120 s

(preheating)

(heating)

to 10 s

to 30 s

235

210