SN74LVC2G06DBVR datasheet(1/12 Pages) TI

Part #	SN74LVC2G06DBVR

Description	DUAL INVERTER BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS

PDF	12 Pages

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Manufacturer	TI [Texas Instruments]

Direct Link	http://www.ti.com

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SN74LVC2G06

DUAL INVERTER BUFFER/DRIVER

WITH OPENDRAIN OUTPUTS

SCES307E − AUGUST 2001 − REVISED SEPTEMBER 2003

1

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

D Available in the Texas Instruments

NanoStar

 and NanoFree Packages

D Supports 5-V VCC Operation

D Max tpd of 3.4 ns at 3.3 V

D Low Power Consumption, 10-µA Max ICC

D ±24-mA Output Drive at 3.3 V

D Typical VOLP (Output Ground Bounce)

<0.8 V at VCC = 3.3 V, TA = 25°C

D Typical VOHV (Output VOH Undershoot)

>2 V at VCC = 3.3 V, TA = 25°C

D Inputs and Open-Drain Outputs Accept

Voltages up to 5.5 V

D Ioff Supports Partial-Power-Down Mode

Operation

D Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

D ESD Protection Exceeds JESD 22

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

This dual inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation.

The output of the SN74LVC2G06 device is open drain and can be connected to other open-drain outputs to

implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74LVC2G06YEAR

−40

°C to 85°C

NanoFree

 − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Tape and reel

SN74LVC2G06YZAR

_ _ _CT_

−40

°C to 85°C

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Tape and reel

SN74LVC2G06YEPR

_ _ _CT_

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SN74LVC2G06YZPR

−40

°C to 85°C

SOT (SOT-23) − DBV

Tape and reel

SN74LVC2G06DBVR

C06_

−40

°C to 85°C

SOT (SC-70) − DCK

Tape and reel

SN74LVC2G06DCKR

CT_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

• = Pb-free).

Copyright

 2003, Texas Instruments Incorporated

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

6

5

4

1A

GND

2A

1Y

VCC

2Y

3

2

1

4

5

6

2A

GND

1A

2Y

VCC

1Y

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

NanoStar and NanoFree are trademarks of Texas Instruments.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

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