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LT1933 Datasheet(PDF) 14 Page - Linear Technology |
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LT1933 Datasheet(HTML) 14 Page - Linear Technology |
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14 / 16 page  14 LT1933 1933f VIN 14.5V TO 36V OFF ON C3 0.1µF D3, 6V D1 L1 47µH R2 10k R1 86.6k C1 10µF 1933 TA02d C2 2.2µF VOUT 12V/450mA D2 VIN BOOST GND FB SHDN SW LT1933 5 4 1 6 23 VIN 3.6V TO 20V OFF ON C3 0.1µF D2 L1 10µH R2 10k R1 4.42k C1 22µF 2x 1933 TA02a C2 2.2µF VOUT 1.8V/500mA VIN BOOST GND FB SHDN SW LT1933 D1 5 4 1 6 23 VIN 4.5V TO 36V OFF ON C3 0.1µF D2 L1 22µH R2 10k R1 16.5k C1 22µF 6.3V 1933 TA02b C2 2.2µF VOUT 3.3V/500mA VIN BOOST GND FB SHDN SW LT1933 D1 5 4 1 6 23 VIN 6.3V TO 36V OFF ON C3 0.1µF D2 L1 33µH R2 10k R1 30.1k C1 22µF 6.3V 1933 TA02c C2 2.2µF VOUT 5V/500mA VIN BOOST GND FB SHDN SW LT1933 D1 5 4 1 6 23 12V Step-Down Converter 1.8V Step-Down Converter 3.3V Step-Down Converter 5V Step-Down Converter should be placed on the same side of the circuit board, and their connections should be made on that layer. Place a local, unbroken ground plane below these components, and tie this ground plane to system ground at one location, ideally at the ground terminal of the output capacitor C1. The SW and BOOST nodes should be as small as possible. Finally, keep the FB node small so that the ground pin and ground traces will shield it from the SW and BOOST nodes. Include two vias near the GND pin of the LT1933 to help remove heat from the LT1933 to the ground plane. High Temperature Considerations The die temperature of the LT1933 must be lower than the maximum rating of 125°C. This is generally not a concern unless the ambient temperature is above 85°C. For higher temperatures, care should be taken in the layout of the circuit to ensure good heat sinking of the LT1933. The maximum load current should be derated as the ambient temperature approaches 125°C. The die temperature is calculated by multiplying the LT1933 power dissipation by the thermal resistance from junction to ambient. Power dissipation within the LT1933 can be estimated by calculating the total power loss from an efficiency measurement and subtracting the catch diode loss. The resulting temperature rise at full load is nearly independent of input voltage. Thermal resistance depends on the layout of the circuit board, but a value of 125°C/W is typical. Die temperature rise was measured on a two-layer, five by five cm circuit board in still air. The LT1933 producing 5V at 500mA showed a temperature rise of 28°C, allowing it to deliver full load to 97°C ambient. Above this tempera- ture the load current should be reduced. For 3.3V at 500mA the temperature rise is 24°C. Other Linear Technology Publications Application notes AN19, AN35 and AN44 contain more detailed descriptions and design information for Buck regulators and other switching regulators. The LT1376 data sheet has a more extensive discussion of output ripple, loop compensation and stability testing. Design Note DN100 shows how to generate a bipolar output supply using a Buck regulator. TYPICAL APPLICATIO S |
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