K2000F1 datasheet(13/224 Pages) TECCOR

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Quality and Reliability

Reliability Stress Tests

The following table contains brief descriptions of the reliability tests commonly used in evaluating Teccor product reliability on a peri-

odic basis. These tests are applied across product lines depending on product availability and test equipment capacities. Other tests

may be performed when appropriate.

Flammability Test

For the UL 94V0 flammability test, all expoxies used in Teccor encapsulated devices are recognized by Underwriters Laboratories

Test Type

Typical Conditions

Test Description

Standards

High Temperature

AC Blocking

TA = 100 °C to 150 °C, Bias @

100%

Rated VDRM, t = 24 hrs to 1000 hrs

Evaluation of the reliability of

product under bias conditions

and elevated temperature

MIL-STD-750, M-1040

High Temperature

Storage Life

TA = 150 °C, t = 250 to 1000 hrs

Evaluation of the effects on

devices after long periods of

storage at high temperature

MIL-STD-750, M-1031

Temperature and Humidity

Bias Life

TA = 85 °C to 95 °C, rh = 85% to

95%

Bias @ 80% Rated VDRM

(320 VDC max)

t = 168 to 1008 hrs

Evaluation of the reliability of non-

hermetic packaged devices in

humid environments

EIA / JEDEC, JESD22-A101

Temperature Cycle

[Air to Air]

TA = -65°C to 150°C,

cycles = 10 to 500

Evaluation of the device’s ability

to withstand the exposure to

extreme temperatures and the

forces of TCE during transitions

between temperatures

MIL-STD-750, M-1051,

EIA / JEDEC, JESD22-A104

Thermal Shock

[Liquid to Liquid]

TA = 0 °C to 100 °C, ttxfr =

≤10 s,

cycled = 10 to 20

Evaluation of the device’s ability

to withstand the sudden changes

in temperature and exposure to

extreme temperatures

MIL-STD-750, M-1056

Autoclave

TA = 121 °C, rh = 100%, P = 15 psig,

t = 24 hrs to 168 hrs

Accelerated environmental test to

evaluate the moisture resistance

of plastic packages

EIA / JEDEC, JESD22-A102

Resistance to

Solder Heat

TA = 260 °C, t = 10 s

Evaluation of the device’s ability

to withstand the temperatures as

seen in wave soldering

operations

MIL-STD-750, M-2031

Solderability

Steam aging = 1 hr to 8 hrs,

Tsolder = 245 °C, Flux = R

Evaluation of the solderability of

device terminals after an

extended period

MIL-STD-750, M-2026,

ANSI-J-STD-002

K2000F1 Datasheet(PDF) 13 Page - Teccor Electronics

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