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LMB05S Datasheet(PDF) 1 Page - Chip Integration Technology Corporation |
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LMB05S Datasheet(HTML) 1 Page - Chip Integration Technology Corporation |
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1 / 3 page ![]() 1 ■ Features ■ Outline Surge overload ratings to 35 amperes peak. • Save space on printed circuit board. • Ideal for automated replacement. • Reliable low cost construction utilizing molded plastic • technology results in inexpensive product. Glass passivated chip junctions. • LMB05S THRU LMB10S 0.8A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers ■ Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, LMBS • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 • Polarity : marked on body • Weight : 0.129grams ■ Maximum ratings and electrical characteristics O Rating at 25 C ambient temperature unless otherwise specified. Operating temperature O T ( C) J -55 ~ +150 Max. forward voltage O @0.8A, T = 25 C A V (V) F Max. DC blocking voltage V (V) R Max. RMS voltage V (V) R M S 70 140 280 35 420 560 Max. repetitive peak reverse voltage V (V) R R M 100 200 400 50 600 800 Marking code LMB1S LMB2S LMB4S LMB05S LMB6S LMB8S Symbol MB1S MB2S MB4S MB05S MB6S MB8S 100 200 400 50 600 800 1.1 700 1000 LMB10S MB10S 1000 Maximum aversge forward rectified output current Forward surge current Reverse current Parameter Typical junction capacitance Storage temperature Dimensions in inches and (millimeters) LMBS .157(4.0) .062(1.6) .106(2.7) .193(4.9) .031(0.8) .141(3.6) .047(1.2) .091(2.3) .177(4.5) .020(0.5) + .275(7.0) MAX. .067(1.7) .008(0.2)MAX .043(1.1) .051(1.3) .028(0.7) .014(0.35) .006(0.15) I F I F S M I R O at T = 40 C A 8.3ms single half sine-wave superimposed on rate load (JEDEC method) O V = V T = 25 C R R R M A O V = V T = 100 C R R R M A Conditions Symbol MIN. TYP. MAX. UNIT 500 5.0 30 A A uA 0.8 C J 13 pF T S T G -55 +150 O C at 1.0MHz and applied reverse voltage of 4.0V DC Document ID : DS-22B47 Revised Date : 2016/07/07 Revision : C |
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