PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

GD65232DBR

ACTIVE

SSOP

DB

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

GD65232DW

ACTIVE

SOIC

DW

20

25

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

GD65232DWR

ACTIVE

SOIC

DW

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

GD65232N

ACTIVE

PDIP

N

20

20

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

GD65232PW

ACTIVE

TSSOP

PW

20

70

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

GD65232PWR

ACTIVE

TSSOP

PW

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

GD75232DB

OBSOLETE

SSOP

DB

20

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

GD75232DBR

ACTIVE

SSOP

DB

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

GD75232DW

ACTIVE

SOIC

DW

20

25

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

GD75232DWR

ACTIVE

SOIC

DW

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

GD75232N

ACTIVE

PDIP

N

20

20

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

GD75232PW

ACTIVE

TSSOP

PW

20

70

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

GD75232PWR

ACTIVE

TSSOP

PW

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

PACKAGE OPTION ADDENDUM

www.ti.com

4-Mar-2005

Addendum-Page 1