ADT75 datasheet(8/25 Pages) AD

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Data Sheet

ADT75

Rev. B | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

DD to GND

–0.3 V to +7 V

SDA Input Voltage to GND

–0.3 V to V

DD + 0.3 V

SDA Output Voltage to GND

–0.3 V to V

DD + 0.3 V

SCL Input Voltage to GND

–0.3 V to V

DD + 0.3 V

OS/ALERT Output Voltage to GND

–0.3 V to V

DD + 0.3 V

Operating Temperature Range

–55°C to +150°C

Storage Temperature Range

–65°C to +160°C

Maximum Junction Temperature, T

JMAX

150.7°C

8-Lead MSOP (RM-8)

Power Dissipation1, 2

MAX = (TJMAX − TA)/θJA

Thermal Impedance3

JA, Junction-to-Ambient (Still Air)

205.9°C/W

JC, Junction-to-Case

43.74°C/W

8-Lead SOIC (R-8)

Power Dissipation1, 2

MAX = (TJMAX − TA)/θJA

Thermal Impedance3

JA, Junction-to-Ambient (Still Air)

157°C/W

JC, Junction-to-Case

56°C/W

IR Reflow Soldering

Peak Temperature

220°C (0°C/5°C)

Time at Peak Temperature

10 sec to 20 sec

Ramp-Up Rate

3°C/sec maximum

Ramp-Down Rate

–6°C/sec maximum

Time 25°C to Peak Temperature

6 minutes maximum

IR Reflow Soldering (Pb-Free Package)

Peak Temperature

260°C (+0°C)

Time at Peak Temperature

20 sec to 40 sec

Ramp-Up Rate

3°C/sec maximum

Ramp-Down Rate

–6°C/sec maximum

Time 25°C to Peak Temperature

8 minutes maximum

1 Values relate to package being used on a standard 2-layer PCB. This gives a

worst case θJAand θJC. Refer to Figure 3 for a plot of maximum power

dissipation vs. ambient temperature (TA).

2 T

A = ambient temperature.

3 Junction-to-case resistance is applicable to components featuring a

preferential flow direction, for example, components mounted on a heat

sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-

mounted components.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

TEMPERATURE (

°C)

1.2

0.8

1.0

0.6

0.2

0.4

MAX PD = 3.4mW AT 150

°C

Figure 3. MSOP Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION

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