1

MB05F~MB10F

Miniature Glass Passivated Single-Phase

Surface Mount Flat Bri dge Rectifier

Major Ratings and Characteristics

0.5A , 0.8A

Features

●

Low profile space

●

Ideal for automated placement

●

Glass passivated chip junction

●

Low forward voltage drop

●

Low leakage current

●

High forward surge capability

●

High temperature soldering：

260℃/10 seconds at terminals

●

Component in accordance to

RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date

●

Case: MBF Molded plastic

over glass passivated chip

●

Terminals: Solder plated, solderable per

J-STD-002B and JESD22-B102D

●

Polarity: Polarity symbols marked on body

Maximum Ratings & Thermal Characteristics & Electrical Characteristics

Symbol MB05F MB1F MB2F MB4F MB6F MB8F MB10F UNIT

50

100

200

400

600

800 1000

V

35

70

140

280

420

560

700

V

50

100

200

400

600

800 1000

V

Maximum average forward output rectified

A

V

μA

p F

(NOTE 1)

(NOTE 2)

(NOTE 1)

℃

NOTE1

:On glass epoxy P.C.B. mounted on 0.05

×0.05″(1.3×1.3mm) pads

NOTE2

:On aluminum substrate P.C.B. with an area of 0.8″×0.8″(20

×20mm) mounted

on 0.05

×0.05″(1.3×1.3mm) solder pad

13

℃/ W

A

0.5

0.8

35

1

5.0

100

85

70

20

–55 to +150

Maximum DC blocking voltage

Operating junction and storage temperature range

Typical junction capacitance per leg at 4.0 V ,1MHz

Maximum instantaneous forwad voltage drop

per leg at 0.4A

Thermal resistance per leg

Peak forward surge current 8.3 ms single half sine-wave

superimposed on rated load(JEDEC Method)

Maximum DC reverse current at

rated DC blocking voltage per leg

Maximum RMS voltage

0.5A , 0.8A

35 A

5.0

μA

50-1000V

1.0V

Maximum repetitive peak reverse voltage

150

°C

星合电子

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