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LEBQ7WP Datasheet(PDF) 15 Page - OSRAM GmbH |
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LEBQ7WP Datasheet(HTML) 15 Page - OSRAM GmbH |
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15 / 24 page  Version 1.9 - OS-PCN-2016-024-A LE B Q7WP 2017-05-11 15 Recommended Solder Pad 7) page 23 Reflow soldering Empfohlenes Lötpaddesign 7) Seite 23 Reflow-Löten Note: Do not use exposed copper MCPCB technology for automotive applications For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning. Anm.: Für Automobil Anwendungen darf kein exposed copper MCPCB verwendet werden. Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für alle Arten einer nasschemischen Reinigung und Ultraschallreinigung nicht geeignet. |
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