SSD1801Z datasheet(5/42 Pages) ETC

Part #	SSD1801Z

Description	LCD Segment / Common Driver with Controller for Character Display System

PDF	42 Pages

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Manufacturer	ETC [List of Unclassifed Manufacturers]

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SOLOMON

Rev 1

01/2003

SSD1801 Series

PIN ARRANGEMENT OF SSD1801Z GOLD BUMP DIE

Alignment Keys

Figure 2 – SSD1801Z Pin Arrangement

Die Size:

6170um x 1480um (include scribe line)

6070um x 1380um (exclude scribe line)

Die Thickness:

670 +/-25um

Bump Size

Minimum Pitch

PAD: 1-63

52.15 x 60.2 um

76.3um

PAD: 65-79,

164-178 74.9 x 42 um

63.7um

PAD: 81-162

42 x 74.9 um

63.7um

PAD: 64,80,163,179

52.15 X 52.15 um

Bump Height: Nominal

18um

Note:

1. The die faces up in the diagram.

2. Coordinates are reference to the center of the chip.

3. Unit of coordinates and size of all alignment keys are in um.

4. All alignment keys do not contain gold bump.

(-2835, -598.5)

37.6

µm

8.75

µm

(2835, -598.5)

37.6

µm

8.75

µm

Center (-2940.9, 480.0)

26.3

µm 26.3 µm 26.3 µm

Center (2940.9, 480.0)

26.3

µm 26.3 µm 26.3 µm

61.3

µm

Center (-2101.9, 169.6)

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