bq2057, bq2057C

bq2057T, bq2057W

SLUS025F − MAY 2001 − REVISED JULY 2002

21

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MECHANICAL DATA

Notes:

1.

Dimension

Inches

Millimeters

Min.

Max.

Min.

Max.

A

-

0.043

-

1.10

A1

0.002

0.006

0.05

0.15

B

0.007

0.012

0.18

0.30

C

0.004

0.007

0.09

0.18

D

0.1

14

0.122

2.90

3.10

E

0.169

0.176

4.30

4.48

e

0.0256BSC

0.65BSC

H

0.246

0.256

6.25

6.50

8−Pin

SOIC

8−Pin SN (

Dimension

Inches

Millimeters

Min.

Max.

Min.

Max.

A

0.060

0.070

1.52

1.78

A1

0.004

0.010

0.10

0.25

B

0.013

0.020

0.33

0.51

C

0.007

0.010

0.18

0.25

D

0.185

0.200

4.70

5.08

E

0.150

0.160

3.81

4.06

e

0.045

0.055

1.14

1.40

H

0.225

0.245

5.72

6.22

L

0.015

0.035

0.38

0.89

Controlling dimension: millimeters. Inches shown for reference only.

2

’D’ and ’E’ do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0,15 mm per side

3

Each lead centerline shall be located within

±0,10 mm of its exact true position.

4

Leads shall be coplanar within 0,08 mm at the seating plane.

5

Dimension ’B’ does not include dambar protrusion. The dambar protrusion(s) shall not cause the lead width

to exceed ’B’ maximum by more than 0,08 mm.

6

Dimension applies to the flat section of the lead between 0,10 mm and 0,25 mm from the lead tip.

7

’A1’ is defined as the distance from the seating plane to the lowest point of the package body (base plane).