© TT electronics plc

Issue B

11/2016

Page 3

TT Electronics | Optek Technology, Inc.

1645 Wallace Drive, Ste. 130, Carrollton, TX USA 75006 |Ph: +1 972 323 2200

www.ttelectronics.com | sensors@ttelectronics.com

General Note

TT Electronics reserves the right to make changes in product specification without

notice or liability. All information is subject to TT Electronics’ own data and is

considered accurate at time of going to print.

OVSA1xBLCR8 Series

Standard Bins

intensity bin and a single color bin. Orders are filled using all intensity and color bins listed in the following tables. Optek

will not accept orders for single intensity bins or single color bins.

RED: OVSA1SBLCR8

IV Code

Min (mcd)

Max (mcd)

Xb

2240

2800

Ya

2800

3550

Yb

3550

4500

Z0

4500

5600

AMBER: OVSA1ABLCR8

IV Code

Min (mcd)

Max (mcd)

Yb

3550

4500

Z0

4500

5600

A0

5600

7100

B0

7100

9000

RED: OVSA1SBLCR8

nm Code

Min

Max

RA

618

630

AMBER: OVSA1ABLCR8

nm Code

Min

Max

A2

584

587

A3

587

590

A4

590

593

A5

593

596

A6

596

599

Dominant Wavelength (nm)

Solder = Lead-Free

Average ramp-up rate = 4°C / sec. max

Peak temperature = 250°C max.

Preheat temperature: 150 - 220°C

Time within 5°C of actual peak temperature

= 10 sec. max

Preheat time: 120 sec. max.

Ramp-down rate = 6°C / sec. max.

Duration above 217°C is 60 sec. max

Reflow Solder Profile