| Manufacturer | Part # | Datasheet | Description |
 LM Technologies Ltd |
LM048
|
11Mb/6P
|
LM048 Bluetooth® v2.0, v2.1 RS232 Serial Adapter
10/JUL/2019
|
|
LM048-3001
|
11Mb/6P
|
LM048 Bluetooth® v2.0, v2.1 RS232 Serial Adapter
10/JUL/2019
|
|
LM048-V4.22-ADAPTOR
|
647Kb/8P
|
LM Technologies Ltd
25-06-2012
|
| Search Partnumber :
Start with "LM048" -
Total : 75 ( 1/4 Page) |
 Shanghai Leiditech Elec... |
LM0402
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-10NG-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-10NH-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-10NJ-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-11NG-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-11NH-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-11NJ-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-12NG-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-12NH-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-12NJ-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-13NG-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-13NH-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-13NJ-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-15NG-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-15NH-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-15NJ-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|
|
LM0402-16NG-N
|
2Mb/6P |
This specification applies to Wire Wound Ceramic Chip Inductors
|