| Manufacturer | Part # | Datasheet | Description |
 NXP Semiconductors |
SOT545-3
|
15Kb / 1P |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
2004 Feb 05 |
|
SOT765-1
|
13Kb / 1P |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
2002 Jun 07 |
 Analog Devices |
CP-40-1
|
76Kb / 1P |
40-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 6 x 6 mm Body, Very Thin Quad
|
 ILSI America LLC |
38-BX0F12.5-32.768
|
51Kb / 2P |
2 Lead Metal Package Crystal, 3 mm x 8 mm, 2 mm x 6 mm, 1 mm x 5 mm
|
 NXP Semiconductors |
SOT486-1
|
242Kb / 1P |
plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
2008 |
|
SOT926-1
|
239Kb / 1P |
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
2009 |
 ILSI America LLC |
I523
|
43Kb / 1P |
Surface Mount Oscillator, TCXO, TCVCXO Metal Package, 9 mm x 11 mm
|
|
I525
|
44Kb / 1P |
Surface Mount Oscillator, TCXO, TCVCXO Metal Package, 9 mm x 11 mm
|
|
ISM61
|
104Kb / 2P |
9 mm x 14 mm Plastic Package SMD Oscillator, TTL / HC-MOS
|
|
ISM65
|
51Kb / 2P |
9 mm x 14 mm FR-4 Package SMD Oscillator, LVPECL / LVDS
|