Features
• Specifications per DSCC VID V62/08629
• Full Mil-Temp Electrical Performance from -55°C to +125°C
• Controlled Baseline with One Wafer Fabrication Site and
One Assembly/Test Site
• Full Homogeneous Lot Processing in Wafer Fab
• No Combination of Wafer Fabrication Lots in Assembly
• Full Traceability Through Assembly and Test by
Date/Trace Code Assignment
• Enhanced Process Change Notification
• Enhanced Obsolescence Management
• Eliminates Need for Up-Screening a COTS Component
• Output Voltages . . . . . . . . . . . . . . 2.500V, 4.096V, 5.000V
• Initial Accuracy . . . . . . . . . . . . . . . . . . . . .±0.5mV, ±1.0mV
• Input Voltage Range. . . . . . . . . . . . . . . . . . . 3.5V to 16.5V
• Output Voltage Noise . . . . . . . . .4.5μVP-P (0.1Hz to 10Hz)
• Supply Current . . . . . . . . . . . . . . . . . . . . . . . .180μA (Max)
• Temperature Coefficient . . . . . . . . . . . . 3ppm/°C, 5ppm/°C
• Output Current Capability. . . . . . . . . . . . . . . Up to ±7.0mA
• Operating Temperature Range. . . . . . . . .-55°C to +125°C
• Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ld SOIC