BAT54 Family

Surface Mount Schottky Barrier Diode

2

Document No.: F41806F

07-FEB-2022 V 2.2

www.futurewafer.com.tw

FQE-001-04

2. Contents

1. Synopsis ...................................................................................................................................................................................... 1

1-1. General Description ................................................................................................................................................................. 1

1-2. Feature List .............................................................................................................................................................................. 1

1-3. Mechanical Characteristics...................................................................................................................................................... 1

1-4. Device Characteristics ............................................................................................................................................................. 1

2. Contents....................................................................................................................................................................................... 2

3. Electrical Property ...................................................................................................................................................................... 3

3-1. Electrical Characteristics ......................................................................................................................................................... 3

3-2. Thermal Characteristics........................................................................................................................................................... 3

3-3. Ratings and Characteristics Curve-Fig 1~2............................................................................................................................. 3

3-3. Ratings and Characteristics Curve-Fig 3~7............................................................................................................................. 4

4. Soldering Parameters ................................................................................................................................................................. 5

5. Package Information................................................................................................................................................................... 6

5-1. Dimension-SOT23 ................................................................................................................................................................... 6

5-2. PCB Pad Layout Recommendation-SOT23 ............................................................................................................................ 6

5-3. Dimension-SOT323 ................................................................................................................................................................. 7

5-4. PCB Pad Layout Recommendation-SOT323 .......................................................................................................................... 7

5-5. Dimension-SOT363 ................................................................................................................................................................. 8

5-6. PCB Pad Layout Recommendation-SOT363 .......................................................................................................................... 8

5-7. Dimension-SOD123................................................................................................................................................................. 9

5-8. PCB Pad Layout Recommendation-SOD123.......................................................................................................................... 8

5-9. Dimension-SOD323................................................................................................................................................................. 9

5-10. PCB Pad Layout Recommendation-SOD323........................................................................................................................ 9

5-11. Dimension-SOD323-FL ....................................................................................................................................................... 10

5-12. PCB Pad Layout Recommendation-SOD323-FL ................................................................................................................ 10

5-13. Dimension-SOD523-FL ....................................................................................................................................................... 11

5-14. PCB Pad Layout Recommendation-SOD523-FL ................................................................................................................ 11

5-15. Dimension-DFN1006-2L ...................................................................................................................................................... 12

5-16. PCB Pad Layout Recommendation-DFN1006-2L............................................................................................................... 12

6. Packing....................................................................................................................................................................................... 13

6-1. Taping and Reel Specification-SOT23 / SOT323.................................................................................................................. 13

6-2. Embossed Carrier Tape Specification-SOT23 / SOT323...................................................................................................... 13

6-3. Taping and Reel Specification-SOT363 ................................................................................................................................ 14

6-4. Embossed Carrier Tape Specification-SOT363 .................................................................................................................... 14

6-5. Taping and Reel Specification-SOD123 / SOD323 / SOD323FL ......................................................................................... 15

6-6. Embossed Carrier Tape Specification-SOD123 / SOD323 / SOD323FL.............................................................................. 15

6-7. Taping and Reel Specification-SOD523FL............................................................................................................................ 16

6-8. Embossed Carrier Tape Specification-SOD523FL................................................................................................................ 16

6-9. Taping and Reel Specification-DFN1006-2L ......................................................................................................................... 17

6-10. Embossed Carrier Tape Specification-DFN1006-2L ........................................................................................................... 17

6-11. Surface Mount Reel Specification ....................................................................................................................................... 18

6-12. Tape Leader and Trailer Specification................................................................................................................................. 18

7. Ordering Information ................................................................................................................................................................ 19

8. Version ....................................................................................................................................................................................... 20

8-1. History.................................................................................................................................................................................... 20

8-2. Company Profile .................................................................................................................................................................... 20