AD00 Marking, AOZ6606PI datasheet(13/16 Pages) AOSMD

13 / 16 page

Rev. 1.1 November 2018

www.aosmd.com

Page 13 of 16

AOZ6606PI

The power dissipation of inductor can be approximately

calculated by output current and DCR of inductor.

The actual junction temperature can be calculated with

power dissipation in the AOZ6606PI and thermal

impedance from junction to ambient.

The maximum junction temperature of AOZ6606PI is

150ºC, which limits the maximum load current capability.

The thermal performance of the AOZ6606PI is strongly

affected by the PCB layout. Extra care should be taken

by users during design process to ensure that the IC will

operate

under

the

recommended

environmental

conditions.

1. The exposed pad (LX) is connected to internal

Highside FET source and Lowside FET drains.

Connect a large copper plane to LX pin to help ther-

mal dissipation.

2. Do not use thermal relief connection to the VIN and

the GND pin. Pour a maximized copper area to the

GND pin and the VIN pin to help thermal dissipation.

3. Input capacitor should be connected to the VIN pin

and the GND pin as close as possible.

4. Make the current trace from LX pins to L to Co to the

GND as short as possible.

5. Pour copper plane on all unused board area and

connect it to stable DC nodes, like VIN, GND or

VOUT.

6. Keep sensitive signal trace away from the LX pad.

Pinductor_loss IO2 Rinductor 1.1



Tjunction

Ptotal_loss Pinductor_loss

–

 



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